TY - JOUR A1 - Chiang, H A1 - Chung, C A1 - Chen, L A1 - Li, Y A1 - Wong, C P A1 - Fu, S T1 - Processing and shape effects on silver paste electrically conductive adhesives (ECAs). Y1 - 2005// N1 - R831489 JF - JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY J1 - J ADHES SCI TECHNOL VL - 19 IS - 7 SP - 565 EP - 578 ER - TY - JOUR A1 - Dong, H A1 - Moon, K A1 - Wong, C P T1 - Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate. Y1 - 2004// N1 - R831489 JF - JOURNAL OF ELECTRONIC MATERIALS J1 - J ELECTRON MATER VL - 33 IS - 11 SP - 1326 EP - 1330 ER - TY - JOUR A1 - Dong, H A1 - Zhang, Z A1 - Wong, C P T1 - Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications. Y1 - 2005/01/1 N1 - R831489 JF - JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY J1 - J ADHES SCI TECHNOL VL - 19 IS - 2 SP - 87 EP - 94 ER - TY - JOUR A1 - Dong, H A1 - Fan, L A1 - Moon, K A1 - Wong, C P A1 - Baskes, M I T1 - MEAM molecular dynamics study of lead free solder for electronic packaging applications. Y1 - 2005/11/4 N1 - R831489 JF - MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING J1 - MODEL SIMUL MATER SC VL - 13 IS - 8 SP - 1279 ER - TY - JOUR A1 - Dong, H A1 - Moon, K A1 - Wong, C P T1 - Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications. Y1 - 2005// N1 - R831489 JF - JOURNAL OF ELECTRONIC MATERIALS J1 - J ELECTRON MATER VL - 34 IS - 1 SP - 40 EP - 45 ER - TY - JOUR A1 - Dong, H A1 - Li, Y A1 - Yim, M J A1 - Moon, K S A1 - Wong, C P T1 - Investigation of electrical contact resistance for nonconductive film functionalized with π-conjugated self-assembled molecules. Y1 - 2007/02/26 N1 - R831489 JF - APPLIED PHYSICS LETTERS J1 - APPL PHYS LETT VL - 90 IS - 9 SP - 092102 (3 pp.) ER - TY - JOUR A1 - Jiang, H J A1 - Moon, K A1 - Zhang, Z Q A1 - Pothukuchi, S A1 - Wong, C P T1 - Variable frequency microwave synthesis of silver nanoparticles. Y1 - 2006// N1 - R831489 JF - JOURNAL OF NANOPARTICLE RESEARCH VL - 8 IS - 1 SP - 117 EP - 124 ER - TY - JOUR A1 - Jiang, H A1 - Moon, K A1 - Lu, J A1 - Wong, C P T1 - Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization. Y1 - 2005/11/ N1 - R831489 JF - JOURNAL OF ELECTRONIC MATERIALS J1 - J ELECTRON MATER VL - 34 IS - 11 SP - 1432 EP - 1439 ER - TY - JOUR A1 - Jiang, H A1 - Moon, K A1 - Li, Y A1 - Wong, C P T1 - Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites. Y1 - 2006/06/27 N1 - R831489 JF - CHEMISTRY OF MATERIALS J1 - CHEM MATER VL - 18 IS - 13 SP - 2969 EP - 2973 ER - TY - JOUR A1 - Jiang, H A1 - Zhu, L A1 - Moon, K A1 - Wong, C P T1 - Low temperature carbon nanotube film transfer via conductive polymer composites. Y1 - 2007/02/23 N1 - R831489 JF - NANOTECHNOLOGY J1 - ACS SYM SER J2 - NANOTECHNOLOGY VL - 18 IS - 12 SP - 125203 (4 pp.) ER - TY - JOUR A1 - Jiang, H A1 - Moon, K A1 - Sun, Y A1 - Wong, C P A1 - Hua, F A1 - Pal, T A1 - Pal, A T1 - Tin/indium nanobundle formation from aggregation or growth of nanoparticles. Y1 - 2008/01/ N1 - R831489 JF - JOURNAL OF NAONOPARTICLE RESEARCH VL - 10 IS - 1 SP - 41 EP - 46 ER - TY - JOUR A1 - Li, Y A1 - Xiao, F A1 - Moon, K A1 - Wong, C P T1 - Novel curing agent for lead-free electronics: amino acid. Y1 - 2005/01/15 N1 - R831489 JF - JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY J1 - J POLYM SCI POL CHEM VL - 44 IS - 2 SP - 1020 EP - 1027 ER - TY - JOUR A1 - Li, Y A1 - Moon, K A1 - Wong, C P T1 - Materials science. Electronics without lead. Y1 - 2005/06/ N1 - R831489 JF - SCIENCE J1 - SCIENCE VL - 308 IS - 5727 SP - 1419 EP - 1420 ER - TY - JOUR A1 - Li, Y A1 - Moon, K A1 - Wong, C P T1 - Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives. Y1 - 2005/03/ N1 - R831489 JF - JOURNAL OF ELECTRONIC MATERIALS J1 - J ELECTRON MATER VL - 34 IS - 3 SP - 266 EP - 271 ER - TY - JOUR A1 - Li, Y A1 - Moon, K A1 - Wong, C P T1 - Monolayer-protected silver nano-particle-based anisotropic conductive adhesives: electrical and thermal properties. Y1 - 2005// N1 - R831489 JF - JOURNAL OF ELECTRONIC MATERIALS J1 - J ELECTRON MATER VL - 34 IS - 12 SP - 1573 EP - 1578 ER - TY - JOUR A1 - Li, Y A1 - Moon, K A1 - Wong, C P T1 - Reliability improvement of conductive adhesives on tin (Sn) surfaces. Y1 - 2005// N1 - R831489 JF - JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY J1 - J ADHES SCI TECHNOL VL - 19 IS - 16 SP - 1427 EP - 1444 ER - TY - JOUR A1 - Li, Y A1 - Moon, K A1 - Whitman, A A1 - Wong, C P T1 - Enhancement of electrical properties of electrically conductive adhesives (ECAs) by using novel aldehydes. Y1 - 2006/12/ N1 - R831489 JF - IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES J1 - IEEE T COMPON PACK T VL - 29 IS - 4 SP - 758 EP - 763 ER - TY - JOUR A1 - Li, Y A1 - Moon, K A1 - Wong, C P T1 - Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering. Y1 - 2006/02/ N1 - R831489 JF - JOURNAL OF APPLIED POLYMER SCIENCE J1 - J APPL POLYM SCI VL - 99 IS - 4 SP - 1665 EP - 1673 ER - TY - JOUR A1 - Li, Y A1 - Wong, C P T1 - Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications. Y1 - 2006/01/30 N1 - R831489 JF - MATERIALS SCIENCE AND ENGINEERING: R: REPORTS J1 - NONE VL - 51 IS - 1-3 SP - 1 EP - 35 ER - TY - JOUR A1 - Li, Y A1 - Moon, K A1 - Wong, C P T1 - Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids. Y1 - 2006/03/ N1 - R831489 JF - IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES J1 - IEEE T COMPON PACK T VL - 29 IS - 1 SP - 173 EP - 178 ER - TY - JOUR A1 - Li, Y A1 - Wong, C P T1 - Monolayer protection for eletrochemical migration control in silver nanocomposite. Y1 - 2006/09/12 N1 - R831489 JF - APPLIED PHYSICS LETTERS J1 - APPL PHYS LETT VL - 89 IS - 11 SP - 112112 ER - TY - JOUR A1 - Li, Y A1 - Wong, C P T1 - High performance anisotropic conductive adhesives for lead-free interconnects. Y1 - 2006// N1 - R831489 JF - SOLDERING & SURFACE MOUNT TECHNOLOGY VL - 18 IS - 2 SP - 33 EP - 39 ER - TY - JOUR A1 - Li, Y A1 - Xiao, F A1 - Wong, C P T1 - Novel, environmentally friendly crosslinking system of an epoxy using an amino acid: tryptophan-cured diglycidyl ether of bisphenol A epoxy. Y1 - 2007/01/15 N1 - R831489 JF - JOURNAL OF POLYMER SCIENCE PART A: POLYMER CHEMISTRY VL - 45 IS - 2 SP - 181 EP - 190 ER - TY - JOUR A1 - Li, Y A1 - Yim, M J A1 - Moon, K S A1 - Wong, C P T1 - Novel nano-scale conductive films with enhanced electrical performance and reliability for high performance fine pitch interconnect. Y1 - 2009/02/ N1 - R831489 VL - 32 IS - 1 SP - 123 EP - 129 ER - TY - JOUR A1 - Moon, K A1 - Li, Y A1 - Xu, J W A1 - Wong, C P T1 - Lead-free interconnect technique by using variable frequency microwave. Y1 - 2005// N1 - R831489 JF - JOURNAL OF ELECTRONIC MATERIALS J1 - J ELECTRON MATER VL - 34 IS - 7 SP - 1081 EP - 1088 ER - TY - JOUR A1 - Moon, K A1 - Dong, H A1 - Maric, R A1 - Pothukuchi, S A1 - Hunt, A A1 - Li, Y A1 - Wong, C P T1 - Thermal behavior of silver nanoparticles for low-temperature interconnect applications. Y1 - 2005// N1 - R831489 JF - JOURNAL OF ELECTRONIC MATERIALS J1 - J ELECTRON MATER VL - 34 IS - 2 SP - 168 EP - 175 ER - TY - JOUR A1 - Yim, M J A1 - Li, Y A1 - Moon, K A1 - Paik, K W A1 - Wong, C P T1 - Review of recent advances in electrically conductive adhesive materials and technologies in electronic packaging. Y1 - 2008// N1 - R831489 JF - JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY J1 - J ADHES SCI TECHNOL VL - 22 IS - 14 SP - 1593 EP - 1630 ER -